Message to members of the APS Division of Materials Physics
Authorized by Robert Nemanich, DMP Secretary/Treasurer
Dear DMP Members,

We want to bring to your attention an exciting opportunity for your students to interact with Chinese students in an interesting forum. A major aim of this forum is to encourage cross-cultural interaction and discussions. There are openings for 30 students who are enrolled in US institutions. US students without much experience with China are especially encouraged to apply.

Laura Greene
Chair, DMP
Veep-elect, APS

Event Information
The U.S.-China Young Physicists Forum (YPF) for graduate students in condensed matter and materials physics will be held Feb. 28 - Mar. 1, 2015 (the weekend before the APS March Meeting 2015). It will combine scientific sessions with career development and networking opportunities to provide attendees with:
  • Networking, scientific, and social events with leaders in condensed matter and materials physics
  • Plenary sessions with senior scientists from the United States and China
  • Student parallel sessions, poster sessions, and a networking reception
  • Career development discussions on publishing in peer reviewed journals and careers outside academia
This is a great opportunity for grad students to network with leaders in condensed matter and materials physics, meet their peers from the U.S. and China, and to participate in scientific talks and career development sessions. More information is available online.

Registration Information: Space is limited with each country sending only 30 students (60 total for this meeting). So apply early! The deadline to apply is November 21, 2014. U.S. students without much experience with China are encouraged to apply.

Note: Accepted students will be required to submit a $50 registration fee. Information available at

Travel Costs: For anyone planning to attend the APS March Meeting 2015, there should be no additional travel expenses beyond two extra nights in the hotel. (Some financial assistance may be available.) See and application for full details.
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